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1 ? fn6011.3 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 321-724-7143 | intersil (and design) is a registered trademark of intersil americas inc. copyright ? intersil americas inc. 2004. all rights reserved all other trademarks mentioned are the property of their respective owners. ISL83220E +/-15kv esd protecte d, +3v to +5.5v, 1microamp, 250kbps, rs-232 transmitters/receivers the intersil ISL83220E is a 3.0v to 5.5v powered rs-232 transmitter/receiver which meets ela/tia-232 and v.28/v.24 specifications, even at v cc = 3.0v. additionally, it provides 15kv esd protection (iec61000-4-2 air gap and human body model) on transmitter outputs and receiver inputs (rs-232 pins). targeted applications are pdas, palmtops, and notebook and laptop computers where the low operational, and even lower standby, power consumption is critical. efficient on-chip charge pumps, coupled with a manual powerdown function, reduce the standby supply current to a 1 a trickle. small footprint packaging, and the use of small, low value capacitors ensure board space savings as well. data rates greater than 250kbps are guaranteed at worst case load c onditions. this family is fully compatible with 3.3v only systems, mixed 3.3v and 5.0v systems, and 5.0v only systems. table 1 summarizes the featur es of the isl83320e, while application note an9863 summarizes the features of each device comprising the icl32xxe 3v family. features ? lead-free available as an option (see ordering information) ? esd protection for rs-232 i/o pins to 15kv (iec61000) ? drop in replacement for sp3220e ? meets eia/tia-232 and v.28/v .24 specifications at 3v ? rs-232 compatible outputs at 2.7v ? latch-up free ? on-chip voltage converters require only four external 0.1 f capacitors ? manual powerdown feature with receivers active ? separate receiver enable pin ?r x and t x hysteresis for improved noise immunity ? guaranteed minimum data rate . . . . . . . . . . . . . 250kbps ? guaranteed minimum slew rate . . . . . . . . . . . . . . . 6v/ s ? wide power supply range . . . . . . . single +3v to +5.5v ? low supply current in powerdow n state. . . . . . . . . . .1 a applications ? any system requiring rs-232 communication ports - battery powered, hand-held, and portable equipment - laptop computers, notebooks, palmtops - modems, printers and other peripherals - digital cameras - cellular/mobile phones related literature ? technical brief tb363 ?guidelines for handling and processing moisture sensit ive surface mount devices (smds)? table 1. summary of features part number no. of tx. no. of rx. no. of monitor rx. (r outb ) data rate (kbps) rx. enable function? ready output? manual power- down? automatic powerdown function? ISL83220E 1 1 0 250 yes no yes no data sheet march 2004
2 pinout ISL83220E (soic, ssop, tssop) top view en c1+ v+ c1- c2+ c2- v- r1 in shdn gnd t1 out n.c. t1 in r1 out v cc n.c. 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 ordering information part no. temp. range (c) package pkg. dwg. # ISL83220Eca-t 0 to 70 16 ld ssop (tape and reel) m16.209 ISL83220Ecb-t 0 to 70 16 ld soic (tape and reel) m16.3 ISL83220Ecv 0 to 70 16 ld tssop m16.173 ISL83220Ecv-t 0 to 70 16 ld tssop (tape and reel) m16.173 ISL83220Ecvz (see note) 0 to 70 16 ld tssop (lead-free) m16.173 ISL83220Ecvz-t (see note) 0 to 70 16 ld tssop (lead-free, tape and reel) m16.173 note: intersil lead-free products employ special lead-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which is compatible with both snpb and lead-free soldering operations. intersil lead-free products are msl classified at lead-free peak reflow temperatures that meet or exceed the lead-free requirements of ipc/jedec j std-020b. pin descriptions pin function v cc system power supply input (3.0v to 5.5v). v+ internally generated positiv e transmitter supply (+5.5v). v- internally generated negative transmitter supply (-5.5v). gnd ground connection. c1+ external capacitor (voltage doubler) is connected to this lead. c1- external capacitor (voltage doubler) is connected to this lead. c2+ external capacitor (voltage inve rter) is connected to this lead. c2- external capacitor (voltage inve rter) is connected to this lead. t in ttl/cmos compatible transmitter inputs. t out 15kv esd protected , rs-232 level (nominally 5.5v) transmitter outputs. r in 15kv esd protected , rs-232 compatible receiver inputs. r out ttl/cmos level receiver outputs. en active low receiver enable control; doesn?t disable r outb outputs. shdn active low input shuts down transmitters and on-board power supply, to place device in low power mode. n.c. no internal connection. ISL83220E
3 typical operating circuit ISL83220E 15 v cc t1 out t1 in t 1 0.1 f + 0.1 f + 0.1 f 11 13 2 4 3 7 v+ v- c1+ c1- c2+ c2- + 0.1 f 5 6 r1 out r1 in r 1 8 9 5k ? c 1 c 2 + c 3 c 4 en 1 gnd +3.3v + 0.1 f 14 ttl/cmos logic levels rs-232 levels shdn 16 v cc ISL83220E
4 absolute maximum rati ngs thermal information v cc to ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 6v v+ to ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 7v v- to ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3v to -7v v+ to v- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14v input voltages t in , en , shdn . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 6v r in . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25v output voltages t out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2v r out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to v cc +0.3v short circuit duration t out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous esd rating . . . . . . . . . . . . . . . . . . . . . . . . . see specification table thermal resistance (typical, note 1) ja (c/w) 16 ld wide soic package . . . . . . . . . . . . . . . . . . . 100 16 ld ssop package . . . . . . . . . . . . . . . . . . . . . . . 135 16 ld tssop package . . . . . . . . . . . . . . . . . . . . . . 145 maximum junction temperature (plastic package) . . . . . . . 150c maximum storage temperature range . . . . . . . . . . . -65c to 150c maximum lead temperature (soldering 10s) . . . . . . . . . . . . 300c (lead tips only) operating conditions temperature range ISL83220Ecx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0c to 70c caution: stresses above those listed in ?absolute maximum ratings? may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. note: 1. ja is measured with the component mounted on a low effective therma l conductivity test board in free air. see tech brief tb379 fo r details. electrical specifications test conditions: v cc = 3v to 5.5v, c 1 - c 4 = 0.1 f; unless otherwise specified. typicals are at t a = 25c parameter test conditions temp (c) min typ max units dc characteristics supply current all outputs unloaded, shdn = v cc v cc = 3.15v 25 - 0.3 1.0 ma supply current, powerdown shdn = gnd 25 - 1.0 10 a logic and transmitter inputs and receiver outputs input logic threshold low t in , en , shdn full - - 0.8 v input logic threshold high t in , en , shdn v cc = 3.3v full 2.0 - - v v cc = 5.0v full 2.4 - - v transmitter input hysteresis 25 - 0.3 v input leakage current t in , en , shdn full - 0.01 1.0 a output leakage current en = v cc full - 0.05 10 a output voltage low i out = 1.6ma full - - 0.4 v output voltage high i out = -1.0ma full v cc -0.6 v cc -0.1 - v transmitter outputs output voltage swing all transmitter outputs loaded with 3k ? to ground full 5.0 5.4 - v output resistance v cc = v+ = v- = 0v, transmitter output = 2v full 300 10m - ? output short-circuit current v out = 0v full - 35 60 ma output leakage current v out = 12v, v cc = 0v or 3v to 5.5v, shdn = gnd full - - 25 a receiver inputs input voltage range full -25 - 25 v input threshold low v cc = 3.3v full 0.6 1.2 - v v cc = 5.0v full 0.8 1.5 - v input threshold high v cc = 3.3v full - 1.5 2.4 v v cc = 5.0v full - 1.8 2.4 v input hysteresis 25 - 0.3 - v input resistance full 3 5 7 k ? ISL83220E
5 detailed description the ISL83220E operates from a single +3v to +5.5v supply, guarantees a 250kbps minimum data rate, requires only four small external 0.1 f capacitors, features low power consumption, and meets all ela rs-232c and v.28 specifications. the circuit is di vided into three sections: the charge pump, the transmitter, and the receiver. charge-pump intersil?s new 3.3v family utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate 5.5v transmitter supplies from a v cc supply as low as 3.0v. this allows these devices to maintain rs-232 compliant output levels over the 10% tolerance range of 3.3v powered systems. the effi cient on-chip power supplies require only four small, external 0.1 f capacitors for the voltage doubler and inverter functions, even at v cc = 3.3v. the charge pumps operate discontinuously (i.e., they turn off as soon as the v+ and v- supplies are pumped up to the nominal values), resulting in significant power savings. transmitters the transmitters are proprietary, low dropout, inverting drivers that translate ttl/cm os inputs to eia/tia-232 output levels. coupled with the on-chip 5.5v supplies, these transmitters deliver true rs-232 levels over a wide range of single supply system voltages. the transmitter output disables and assumes a high impedance state when the device enters the powerdown mode (see table 2). this output may be driven to 12v when disabled. all devices guarantee a 250kbps data rate for full load conditions (3k ? and 1000pf), v cc 3.0v. under more typical conditions of v cc 3.3v, r l = 3k ? , and c l = 250pf, the ISL83220E easily op erates at 900kbps. transmitter inputs float if left unconnected, and may cause i cc increases. receivers the ISL83220E device contains a standard inverting receiver that three-states via the en control line. receivers convert rs-232 signals to cm os output levels and accept inputs up to 25v while presenting the required 3k ? to 7k ? input impedance (see figure 1) even if the power is off (v cc = 0v). the receiver?s schmitt trigger input stage uses hysteresis to increase noise immunity and decrease errors due to slow input signal transitions. timing characteristics maximum data rate r l = 3k ?, c l = 1000pf, one transmitter switching full 250 500 - kbps transmitter propagation delay transmitter input to transmitter output, r l = 3k ?, c l = 1000pf t phl 25 - 1.0 - s t plh 25 - 1.0 - s receiver propagation delay receiver input to receiver output, c l = 150pf t phl 25 - 0.20 - s t plh 25 - 0.30 - s receiver output enable time normal operation 25 - 200 - ns receiver output disable time normal operation 25 - 200 - ns transmitter skew t phl - t plh (note 2) 25 - 100 500 ns receiver skew t phl - t plh full - 100 1000 ns transition region slew rate v cc = 3.3v, r l = 3k ? to 7k ?, measured from 3v to -3v or -3v to 3v c l = 150pf to 2500pf 25 4 - 30 v/ s c l = 150pf to 1000pf 25 6 - 30 v/ s esd performance rs-232 pins (t out , r in ) human body model 25 - 15 - kv iec61000-4-2 contact discharge 25 - 8-kv iec61000-4-2 air gap discharge 25 - 15 - kv all other pins human body model 25 - 3-kv note: 2. transmitter skew is measured at the transmitter zero crossing points. electrical specifications test conditions: v cc = 3v to 5.5v, c 1 - c 4 = 0.1 f; unless otherwise specified. typicals are at t a = 25c (continued) parameter test conditions temp (c) min typ max units ISL83220E
6 the ISL83220E receiver disables only when en is driven high. (see table 2). this allows the receiver to monitor external devices, like a modem, even when the ISL83220E is in its 1 a powerdown state. standard receivers driving powered down peripherals must be disabled to prevent current flow through the peripheral?s protection diodes (see figure 2). this renders them useless for wake up functions. operation down to 2.7v ISL83220E transmitter outputs meet rs-562 levels (3.7v), at the full data rate, with v cc as low as 2.7v. rs-562 levels typically ensure interoperability with rs-232 devices. powerdown functionality this 3v family of rs-232 interface devices requires a nominal supply current of 0.3ma during normal operation (not in powerdown mode), which is considerably less than the 5ma to 11ma current required of 5v rs-232 devices. the already low current requirement drops significantly when the device enters powerdown mode. in powerdown, supply current drops to 1 a, because the on-chip charge pump turns off (v+ collapses to v cc , v- collapses to gnd), and the transmitter outputs three-state. this micro-power mode makes these devices ideal for battery powered and portable applications. software controlled (manual) powerdown on the ISL83220E, the powerdown control is via a simple shutdown (shdn ) pin. driving this pin high enables normal operation, while driving it low forces the ic into it?s powerdown state. connect shdn to v cc if the powerdown function isn?t needed. note that the receiver output remains enabled during shutdown (see table 2). for the lowest power consumption during powerdown, the receiver should also be disabled by driving the en input high (see next section). the time to recover from manual powerdown mode is typically 100 s. receiver enable control the ISL83220E also features an en input to control the receiver output. driving en high disables the receiver output placing it in a high impedance state. this is useful to eliminate supply current, due to a receiver output forward biasing the protection diode, when driving the input of a powered down (v cc = gnd) peripheral (see figure 2). capacitor selection the charge pumps require 0.1 f capacitors for 3.3v operation. do not use values smaller than 0.1 f. increasing the capacitor values (by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. when using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. if in doubt, use ca pacitors with a larger nominal value. the capacitor?s equivalent series resistance (esr) usually rises at low temperat ures and it influences the amount of ripple on v+ and v -. power supply decoupling in most circumstances a 0.1 f bypass capacitor is adequate. in applications that are particularly sensitive to power supply noise, decouple v cc to ground with a capacitor of the same value as the charge-pump capacitor c 1 . connect the bypass capacitor as close as possible to the ic. r 1out gnd v rout v cc 5k ? r 1in -25v v rin +25v gnd v cc figure 1. inverting receiver connections table 2. powerdown and enable logic truth table shdn input en input transmitter output receiver output mode of operation l l high-z active manual powerdown l h high-z high-z manual powerdown w/rcvr. disabled h l active active normal operation h h active high-z normal operation w/rcvr. disabled figure 2. power drain through powered down peripheral old v cc powered gnd shdn = gnd v cc rx tx v cc current v out = v cc flow rs-232 chip down uart ISL83220E
7 transmitter output when exiting powerdown figure 3 shows the response of the transmitter output when exiting powerdown mode. as it activates, the transmitter output properly goes to rs-232 levels, with no glitching, ringing, nor undesirable transient s. the transmitter is loaded with 3k ? in parallel with 2500pf. note that the transmitter enables only when the magnitude of the supplies exceed approximately 3v. high data rates the ISL83220E maintains the rs-232 5v minimum transmitter output voltages even at high data rates. figure 4 details a transmitter loopback test circuit, and figure 5 illustrates the loopback test result at 120kbps. for this test, the transmitter is driving an rs-232 load in parallel with 1000pf, at 120kbps. figure 6 shows the loopback results for the transmitter driving 1000pf and an rs-232 load at 250kbps. interconnection with 3v and 5v logic the ISL83220E directly interf aces with 5v cmos and ttl logic families. nevertheless, wi th the device at 3.3v, and the logic supply at 5v, ac, hc, and cd4000 outputs can drive ISL83220E inputs, but ISL83220E outputs do not reach the minimum v ih for these logic families. see table 4 for more information. figure 4. transmitter loopback test circuit time (20s/div) 2v/div 5v/div v cc = +3.3v shdn figure 3. transmitter output when exiting powerdown c1 - c4 = 0.1f t in = low t in = high ISL83220E v cc c 1 c 2 c 4 c 3 + + + + 1000pf v+ v- 5k t in r out c1+ c1- c2+ c2- r in t out + v cc 0.1 f v cc en shdn figure 5. loopback test at 120kbps figure 6. loopback test at 250kbps t1 in t1 out r1 out 5s/div v cc = +3.3v 5v/div c1 - c4 = 0.1f t1 in t1 out r1 out 2s/div 5v/div v cc = +3.3v c1 - c4 = 0.1f ISL83220E
8 15kv esd protection all pins on isl8xxx devices include esd protection structures, but the isl8xxx e family incorporates advanced structures which allow the rs-232 pins (transmitter outputs and receiver inputs) to survive esd events up to 15kv. the rs-232 pins are particularly vulnerable to esd damage because they typically connect to an exposed port on the exterior of the finished pro duct. simply touching the port pins, or connecting a cable, can cause an esd event that might destroy unprotected ics. these new esd structures protect the device whether or not it is powered up, protect without allowing any latchup mechanism to activate, and don?t interfere with rs-232 signals as large as 25v. human body mode l (hbm) testing as the name implies, this test method emulates the esd event delivered to an ic during human handling. the tester delivers the charge through a 1.5k ? current limiting resistor, making the test less severe th an the iec61000 test which utilizes a 330 ? limiting resistor. the hbm method determines an ic?s ability to withstand the esd transients typically present during handling and manufacturing. due to the random nature of these events, each pin is tested with respect to all other pins. the rs-232 pins on ?e? family devices can withstand hbm esd events to 15kv. iec61000-4-2 testing the iec61000 test method applies to finished equipment, rather than to an individual ic. therefore, the pins most likely to suffer an esd event are t hose that are ex posed to the outside world (the rs-232 pins in this case), and the ic is tested in its typical application configuration (power applied) rather than testing each pin-to -pin combination. the lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the hbm test. the extra esd protection built into this device?s rs-232 pins allows the design of equipment meeting level 4 criteria with out the need for additional board level protection on the rs-232 port. air-gap discharge test method for this test method, a charged probe tip moves toward the ic pin until the voltage arcs to it. the current waveform delivered to the ic pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results. the ?e? device rs-232 pins withstand 15kv air-gap discharges. contact discharge test method during the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. the result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than 8kv. all ?e? family devices survive 8kv contact discharges on the rs-232 pins. table 3. logic family compatibility with various supply voltages system power-supply voltage (v) v cc supply voltage (v) compatibility 3.3 3.3 compatible with all cmos families. 5 5 compatible with all ttl and cmos logic families. 5 3.3 compatible with act and hct cmos, and with ttl. ISL83220E outputs are incompatible with ac, hc, and cd4000 cmos inputs. typical performance curves v cc = 3.3v, t a = 25c figure 7. transmitter output voltage vs load capacitance figure 8. slew rate vs load capacitance -6 -4 -2 0 2 4 6 1000 2000 3000 4000 5000 0 load capacitance (pf) transmitter output voltage (v) transmitter at 250kbps v out + v out - load capacitance (pf) slew rate (v/s) 0 1000 2000 3000 4000 5000 5 10 15 20 25 +slew -slew ISL83220E
9 die characteristics substrate potential (powered up): gnd transistor count: 286 process: si gate cmos figure 9. supply current vs load capacitance when transmitting data figure 10. supply current vs supply voltage typical performance curves v cc = 3.3v, t a = 25c (continued) 0 5 10 15 20 25 30 45 35 40 0 1000 2000 3000 4000 5000 load capacitance (pf) supply current (ma) 20kbps 250kbps 120kbps supply current (ma) 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0 0.5 1.0 1.5 2.0 supply voltage (v) 2.5 3.0 3.5 no load all outputs static ISL83220E
10 ISL83220E thin shrink small outlin e plastic packages (tssop) notes: 1. these package dimensions are wi thin allowable dimensions of jedec mo-153-ab, issue e. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e1? does not includ e interlead flash or protrusions. interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of ?b? dimension at maximum ma terial condition. minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. controlling dimension: millimeter. converted inch dimen- sions are not necessarily exact. (angles in degrees) index area e1 d n 123 -b- 0.10(0.004) c a m bs e -a- b m -c- a1 a seating plane 0.10(0.004) c e 0.25(0.010) b m m l 0.25 0.010 gauge plane a2 0.05(0.002) m16.173 16 lead thin shrink small outline plastic package symbol inches millimeters notes min max min max a - 0.043 - 1.10 - a1 0.002 0.006 0.05 0.15 - a2 0.033 0.037 0.85 0.95 - b 0.0075 0.012 0.19 0.30 9 c 0.0035 0.008 0.09 0.20 - d 0.193 0.201 4.90 5.10 3 e1 0.169 0.177 4.30 4.50 4 e 0.026 bsc 0.65 bsc - e 0.246 0.256 6.25 6.50 - l 0.020 0.028 0.50 0.70 6 n16 167 0 o 8 o 0 o 8 o - rev. 1 2/02
11 ISL83220E small outline plast ic packages (ssop) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate bur rs shall not exceed 0.20mm (0.0078 inch) per side. 4. dimension ?e? does not include interl ead flash or protrusions. interlead flash and protrusions shall not exce ed 0.20mm (0.0078 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dam bar protrusion. allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of ?b? dimen- sion at maximum material condition. 10. controlling dimension: millimeter. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) c h 0.25(0.010) b m m 0.25 0.010 gauge plane a2 m16.209 (jedec mo-150-ac issue b) 16 lead shrink small outline plastic package symbol inches millimeters notes min max min max a- 0.078 - 2.00 - a1 0.002 - 0.05 -- a2 0.065 0.072 1.65 1.85 - b 0.009 0.014 0.22 0.38 9 c 0.004 0.009 0.09 0.25 - d 0.233 0.255 5.90 6.50 3 e 0.197 0.220 5.00 5.60 4 e 0.026 bsc 0.65 bsc - h 0.292 0.322 7.40 8.20 - l 0.022 0.037 0.55 0.95 6 n16 167 0 o 8 o 0 o 8 o - rev. 2 3/95
12 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com ISL83220E small outline plast ic packages (soic) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e? does not include inte rlead flash or protrusions. interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. controlling dimension: millimeter. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 o c h 0.25(0.010) b m m m16.3 (jedec ms-013-aa issue c) 16 lead wide body small outline plastic package symbol inches millimeters notes min max min max a 0.0926 0.1043 2.35 2.65 - a1 0.0040 0.0118 0.10 0.30 - b 0.013 0.0200 0.33 0.51 9 c 0.0091 0.0125 0.23 0.32 - d 0.3977 0.4133 10.10 10.50 3 e 0.2914 0.2992 7.40 7.60 4 e 0.050 bsc 1.27 bsc - h 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 l 0.016 0.050 0.40 1.27 6 n16 167 0 o 8 o 0 o 8 o - rev. 0 12/93

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